Dynasolve CU-7是一種用于去除固化的聚酰亞胺材料的樹脂溶解劑。Dynasolve CU-7主要用于光纖,半導體封裝等行業。
Dynasolve CU-7 Cured Polyimide Cleaning Solvent is a formulated solvent used to remove cured polyimide materials.
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Dynasolve CU-7